As far as Lansheng Technology knows: the global semiconductor giant announced an expanded layoff plan, due to a single quarter loss of 2.3 billion US

 According to a report on the 28th local time by MarketWatch, a Dow Jones company's financial website, memory chip maker Micron Technology announced a record quarterly loss due to inventory write-downs of more than $1.4 billion.


The report pointed out that Micron Technology’s second-quarter loss was US$2.31 billion, or US$2.12 per share, with sales of US$3.69 billion, lower than the US$7.79 billion in the same period last year. The company's previous largest quarterly loss on a GAAP basis was $1.94 billion in the same quarter in 2003, according to FactSet records. After accounting for stock-based compensation and restructuring costs from recent layoffs, the company lost $1.91 a share, compared with adjusted earnings of $2.14 a year earlier.


Sanjay Mehrotra, CEO of Micron Technology, said, "We now believe that customer inventories in several end markets have decreased, and we expect the supply-demand balance to gradually improve in the coming months. Excluding the impact of inventory write-downs, the balance sheet's inventory turnover days (DIO ) has peaked in the second fiscal quarter, and the quarterly performance has reached an inflection point that will increase quarter-on-quarter.” Lansheng Technology is also looking forward to its turnaround as soon as possible to achieve quarter-on-quarter growth.


According to Reuters, Micron Technology expects third-quarter revenue to fall by nearly 60% year-on-year, but the sharp decline is in line with Wall Street expectations. Company executives are confident in the long-term prospects, believing that the market size of the industry will hit a record high in 2025.


Micron Technology also stated that it will maintain investment at around US$7 billion in fiscal year 2023, which is the lower limit of the previously set range; it will expand the layoff plan from the previously estimated 10% to 15%.

Comments

Post a Comment

Popular posts from this blog

What are the Benefits of Power Optimizers?

Image
  Power optimizer for solar panels is a DC/DC converter that is connected to each solar panel in the PV system, turning them into smart modules. By constantly monitoring the maximum production capacity of each individual solar module, optimizers can increase your PV plant energy production – potentially increasing revenue and shortening system payback time. Simply put, the main benefit of power optimizer is that it maximizes the performance of each panel individually. What are the benefits of power optimizers and why are they needed? When installing solar panels, the panels are connected into groups or arrays. In the case of roof-mounted and in-roof panels, there are usually 12-20 solar panels in one group. If the productivity of one of these panels decreases (shadows from trees and clouds, dust, bird droppings, failures of PV components and other factors), then the productivity of the whole group decreases. Defective or shaded panels may produce 15 to 25 percent less solar energy ...
Read more

RF Chip Market Pattern

Image
  RF is the abbreviation of Radio Frequency, which refers to radio frequency. The frequency range is between 300KHz and 300GHz. The earliest application of RF is Radio—radio broadcasting (FM/AM). The radio frequency chip is an electronic component that converts radio signal communication into a certain radio signal waveform and sends it out through antenna resonance. In mobile terminals, radio frequency chips and baseband chips are the two most important cores. The RF chip is responsible for RF transceiver, frequency synthesis, and power amplification. The baseband chip is responsible for signal processing and protocol processing. In the entire RF chip track, the RF front-end industry is huge and the market is growing rapidly. The radio frequency front-end (Radio Frequency Front-End) is the part between the antenna and the baseband circuit in the communication system, including the transmission path and the reception path, generally composed of radio frequency power amplifiers, rad...
Read more

Infineon launches new 62 mm package CoolSiC product portfolio to help achieve higher efficiency and power density

Image
  【Lansheng Technology News】 Infineon Technologies AG recently announced the addition of new industry-standard packaging products to its CoolSiC 1200 V and 2000 V MOSFET module series. It uses a mature 62 mm device half-bridge topology design and is based on the newly launched enhancement-mode M1H silicon carbide (SiC) MOSFET technology. This package enables SiC to be used in mid-power applications above 250 kW, where the power density of traditional IGBT silicon technology has reached its limit. Compared with traditional 62mm IGBT modules, its application scope has now expanded to solar energy, servers, energy storage, electric vehicle charging piles, traction, commercial induction cookers and power conversion systems. Enhanced M1H technology can significantly widen the gate voltage window, even at high switching frequencies, without any restrictions, ensuring high gate reliability against induced voltage spikes caused by drivers and layout. Additionally, extremely low switching ...
Read more