Lansheng Technology

  【Lansheng Technology News】 Micron Technology announced its latest mobile phone storage solution at MWC 2024. The company has launched its most compact UFS 4.0 package to date, measuring just 9 x 13 mm, still offering up to 1 TB of capacity and 4300 MB/s sequential read speeds, 4000 MB/s sequential write speeds. Micron said the main reason for launching the smaller solution was feedback from smartphone OEMs. Manufacturers want to leave more space inside the phone for larger batteries. Micron developed the product at its joint customer labs in the U.S., China and South Korea and is built on its 232-layer 3D NAND technology. Compared to the 11 x 13mm solution launched last June, the UFS 4.0 chip has a 20% smaller footprint, reducing power consumption without impacting overall performance. Micron has brought HPM (High Performance Mode), a proprietary feature that optimizes performance during intensive smartphone usage, claiming to be 25% faster when HPM is enabled. Micron has now launc

  【Lansheng Technology News】 Samsung Electronics announced today that the company successfully released its first 12-layer stacked HBM3E DRAM - HBM3E 12H, which is Samsung's largest HBM product to date. Samsung HBM3E 12H supports all-weather maximum bandwidth up to 1280GB/s, and the product capacity also reaches 36GB. Compared with Samsung's 8-layer stacked HBM3 8H, HBM3E 12H has significantly increased bandwidth and capacity by more than 50%. "Artificial intelligence service providers in the current industry increasingly require higher-capacity HBMs, and our new product HBM3E 12H is designed to meet this demand," said Yongcheol Bae, executive vice president of the Memory Product Planning Team at Samsung Electronics , “This new storage solution is part of our efforts to develop multi-layer stacked HBM core technology and provide technology leadership for the high-capacity HBM market in the era of artificial intelligence. HBM3E 12H uses advanced hot-pressed non-condu

  【Lansheng Technology News】 ON Semiconductor recently announced the launch of the 1200V SPM31 intelligent power module (IPM) using new field-stop 7th generation (FS7) insulated gate bipolar transistor (IGBT) technology. The SPM31 IPM is more energy efficient, smaller, and has higher power density than other leading solutions on the market, resulting in lower overall system cost. Because these IPMs integrate optimized IGBTs for higher efficiency, they are ideally suited for three-phase variable frequency drive applications such as heat pumps, commercial heating, ventilation and air conditioning (HVAC) systems, and industrial pumps and fans. It is estimated that about 26% of global greenhouse gas emissions come from operating residential and commercial buildings, of which indirect emissions such as heating, cooling and building power supply account for about 18%. As governments around the world work to meet their energy and climate commitments, more energy-efficient, lower-carbon solut

  【Lansheng Technology News】 ROHM Co., Ltd.'s 650V GaN device (EcoGaN™) is used in Delta Electronics, Inc. (hereinafter referred to as "Delta") Innergie brand 45W output AC adapter (fast charger) "C4 Duo" . Delta is a global provider of green solutions based on IoT technology. Innergie's AC adapter is equipped with ROHM's EcoGaN™ "GNP1150TCA" that improves power system efficiency, thereby improving product performance and reliability while also achieving miniaturization. In the process of promoting a carbon-free society, since the power loss of equipment that handles high power is particularly significant, relevant manufacturers are taking measures to accelerate the pace of energy conservation. In addition, for power supplies, if the device can be operated at high frequency, it can not only save energy, but also achieve miniaturization of the circuit. Therefore, many products are equipped with GaN (gallium nitride) devices that can achieve hig

  【Lansheng Technology News】 Nexperia recently announced that it now offers a portfolio of 22 new planar Schottky diodes in CFP3-HP packages. The product portfolio includes 11 industrial products as well as 11 AEC-Q101 compliant products. This product launch is to support the trend of manufacturers replacing SMx-type packaged devices with smaller CFP packaged devices, especially in automotive applications. These diodes are suitable for DC-DC conversion, freewheeling, reverse polarity protection and OR-ing (hiccup) applications. To maximize design flexibility, device options in the portfolio offer reverse voltage VR(max) from 30 V to 100 V and forward current IF(average) from 1 A to 3 A. A unique feature of the CFP3-HP is the use of an exposed heat sink, thus providing an extremely high level of thermal efficiency (Ptot) in this package size (3.7 mm x 1.8 mm x 0.9 mm). These packages utilize a proprietary copper clip design to address challenging design requirements for efficiency and

  【Lansheng Technology News】February 23, 2024 - Analog Devices, Inc. announced that it has reached an agreement with TSMC to provide long-term chip production capacity supply from Japan Advanced Semiconductor Manufacturing Company ("JASM"), TSMC's controlled manufacturing subsidiary in Kumamoto Prefecture, Japan. Based on the more than 30-year partnership between ADI and TSMC, this agreement provides ADI with more options to expand the production capacity of advanced process nodes to better meet the needs of key platforms in ADI’s business, including wireless BMS (wBMS) and IoT. Gigabit Multimedia Serial Link (GMSL™) applications. The joint efforts of both parties further consolidate ADI's strong hybrid manufacturing network, helping to reduce the impact of external factors and rapidly expand production capacity and scale to meet customer needs. Vivek Jain, executive vice president of global operations and technology at ADI, said: "Our hybrid manufacturing ne