Lansheng Technology

  On June 29, Lansheng Technology News,  Micron Technology  issued a statement on June 28, making an optimistic forecast for the prospects of the chip industry. Micron said that despite the current challenges in the Chinese market, the situation of overcapacity has eased. Micron  said it expects fourth-quarter sales of $4.1 billion, higher than analysts' forecast of $3.87 billion. Micron CEO Sanjay said: "We believe that the storage industry has passed the trough of revenue, and as the industry's supply and demand balance, our profits will gradually improve." Like other semiconductor peers,  Micron  has recently experienced a severe decline in memory chip sales. The sluggish demand for personal computers and smartphones has left the company with a backlog of inventory. The company's near-term forecasts suggest that customers have cleared their high inventories and are starting to repurchase. The memory chip industry is highly volatile and is directly affected by d

  Beijing, China - June 12, 2023 -  Silicon Labs  today introduced a new dual-band FG28 system-on-chip designed for long-range, wide-coverage networks and protocols such as Amazon Sidewalk, Wi-SUN, and other proprietary protocols. FG28 is a dual-band SoC including sub-GHz and 2.4 GHz Bluetooth low energy radios, a built-in artificial intelligence/machine learning accelerator for machine learning inference, and features Silicon Labs' industry-leading Secure Vault™ security technology. Daniel Cooley, Chief Technology Officer of  Silicon Labs , said: "The FG28 SoC meets several key needs of our customers when developing and deploying LPWAN. Through protocols including Bluetooth, the FG28 provides users with a It is an easy way to configure and deploy new devices on the Internet, and the sub-GHz frequency band is designed to support communication between devices for more than a mile, enabling the use of new edge applications in smart agriculture, smart cities and social networks s

  Samsung  announced an updated manufacturing technology roadmap at the annual Samsung Foundry Forum 2023. The company is on track to produce chips at its 2nm and 1.4nm class nodes in 2025 and 2027, respectively. In addition, the company also plans to add a leading 5nm-class RF manufacturing process and start producing GaN chips in the next few years. Compared with SF3 (2nd generation 3nm class) (at the same transistor count), Samsung expects its SF2 (2nm class) manufacturing technology to improve power efficiency by 25% (at the same frequency and transistor count) and improve performance by 12% % (at the same power and complexity), and reduce the area by 5% the company. The company will begin manufacturing mobile SoCs at the 2nm node in 2025, followed by the HPC-enhanced SF2P node in 2026. Meanwhile, the SF1.4 (1.4nm-class) manufacturing process is expected to be available to Samsung customers in 2027. To make its SF2 node more competitive, Samsung intends to ensure that its customers

  Lansheng Technology Information: Recently,  Vishay Intertechnology, Inc.  announced that it has launched two new fixed-gain infrared (IR) sensors: surface mount TSSP93038DF1PZA and leaded TSSP93038SS1ZA, which reduce system cost and improve the stability of outdoor sensor applications. Both products are housed in a small Minimold package with a typical irradiance of 1.3 mW/m² for stable operation in direct sunlight while being sensitive enough to support optical grating applications. Vishay's  new infrared sensor has a controllable sensitivity to work in direct sunlight without unwanted pulses. Additionally, for short-range reflective and proximity/ranging applications, sensor desensitization does not require very low transmitter forward current, which can cause erratic intensity output. The new infrared sensor has a fast response time of 260 μs and a long proximity detection distance (1 meter at 100 mA with the TSAL6100). Under the same setting, the detection distance of the lig

  Silicon Labs , a global leader dedicated to building a more connected world with secure and intelligent wireless connectivity technologies, announced today that Silicon Labs has opened a new Connectivity Lab in its Boston office. The "Connectivity Lab" simulates a modern smart home scenario, which includes a series of Internet of Things (IoT) devices, application software, ecosystems and networks, providing developers with an ideal environment to support them in various protocols and devices. Brands test their Matter prototypes in real-world scenarios. Colin Cureton, Senior Director of IoT Home and Living Ecosystem at  Silicon Labs , said: "Ultimately, all developers will focus on the consumer experience in the home. The 'Connectivity Lab' provides an in-home environment to explore interoperability, as well as test and improve Product performance gives developers the confidence they need to bring innovative products to market." Sarah Scannell, Senior Direc

  June 28, 2023 Lansheng Technology Information -  ON Semiconductor , a leader in smart power and smart sensing technology, has launched an end-to-end positioning system, allowing designers to more easily and quickly develop higher-precision, more Cost-effective, more power-efficient asset tracking solution. The system is based on  ON Semiconductor's , the industry's lowest power Bluetooth® 5.2 MCU, and incorporates software algorithms and components from Unikie and CoreHW to form a fully integrated solution whose components have been optimized to work together. The new Bluetooth low energy solution enables tags to be used to track objects or people with sub-meter accuracy in defined enclosed spaces such as warehouses, shops or other buildings. It scales to a large number of tracked objects, offering performance and cost advantages while reducing development effort and accelerating time-to-market. Packed with innovative advanced features, the RSL15 is ideal for a variety of ind

  At the end of 2021, Mitsubishi Electric and  Toshiba  jointly invested in a semiconductor manufacturing company called "Secco Japan". The company plans to develop a 2nm chip process and start production in the next few years. According to reports, the company will adopt a new transistor structure called "gate transistor" to achieve the 2nm level process technology. In addition, other Japanese semiconductor manufacturers such as Fujitsu, Sony and NEC are also conducting research and development on 2nm chip manufacturing processes. At the end of 2022, Japan's Toyota, Sony,  Renesas  and other eight industry giants jointly established Rapidus. The Japanese government has given huge subsidies, hoping to build advanced semiconductor production lines, from the current 45nm process to the 2nm process. The latest news is that Rapidus has officially announced its future construction plan. It will establish a fab in Hokkaido, Japan, start construction in September 2023,