HBM is out of stock and price increases: Nvidia, AMD add orders

 


【Lansheng Technology Information】According to Taiwan's Electronic Times, citing industry sources, the price of high-bandwidth memory (HBM) has begun to rise due to the surge in demand for artificial intelligence servers.


At present, the world's top three memory chip manufacturers are transferring more production capacity to produce HBM, but because it takes time to adjust production capacity, it is difficult to quickly increase HBM production, and it is expected that the supply of HBM will remain tight in the next two years.


According to Korean media reports, Samsung plans to invest 1 trillion won (about 760 million U.S. dollars) to expand HBM production, aiming to double HBM production capacity by the end of next year, and the company has placed major equipment orders.


This time, Samsung will expand production at the Tianan factory, which is mainly responsible for semiconductor packaging and other downstream processes. HBM mainly improves the data processing speed by vertically stacking multiple DRAMs, so only by adding back-end equipment can the shipment be expanded. Samsung plans to produce products such as HBM2 and HBM2E that are currently being supplied, and plans to mass-produce 8-layer stacked HBM3 and 12-layer HBM3E in the second half of the year.


It is worth mentioning that it was reported in June that another memory chip giant, SK Hynix, has begun to expand the HBM production line, with the goal of doubling the HBM production capacity. The focus of production expansion is HBM3. SK Hynix is preparing to invest in back-end process equipment and will expand the Icheon factory that packages HBM3. It is expected that by the end of this year, the scale of back-end process equipment will nearly double.


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