Intel CPU will use 3D-Stacked cache to challenge AMD 3D V-Cache

 


【Lansheng Technology News】On September 21, Intel CEO Pat Gelsinger revealed a lot of key information during the media Q&A session after the 2023 Innovation Event.


He confirmed that while Intel won't directly adopt 3D caching like AMD, they will also use stacked caching technology, but this technology will not launch with Meteor Lake.


"When you mention V-Cache, you're referring to a specific technology that TSMC is working with some of its customers," Gelsinger said. "Obviously, we have a different makeup, right? And that specific type of The technology is not part of Meteor Lake, but on our roadmap you see the idea that we will put a cache on one chip and we will do the CPU compute on stacked chips and that will obviously be able to use EMIB and Foveros combined into different functions.”


"We are very comfortable that we have advanced technology in next-generation memory architecture, and we have advantages in 3D stacking, whether it is small chips or large packaged chips for AI and high-performance servers, so we have a full range of technology capabilities. We will use these technologies in our products and demonstrate them to Foundry customers."


He makes sense. The technology behind AMD 3D V-Cache comes from TSMC’s SoIC packaging technology. In addition, this chip architecture has been a long-term goal pursued by major chip manufacturers for many years.


Of course, at this stage, the 3D stack cache can be said to be the unique advantage of AMD processors. It can provide assistance to its X3D processors, and it is precisely because of this that these CPUs have become one of the most powerful game processors in the world, and at the same time It can bring high added value to its X series.


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