Intel intends to replace organic substrate materials with glass substrates, and the next generation of chips will use more sand

 

【Lansheng Technology News】Intel recently announced the launch of the industry's first glass substrates for next-generation advanced packaging. This breakthrough achievement will continue to expand the scale of transistors in packages and promote Moore's Law, thereby realizing data-centric application.

Intel claims that "glass substrates" are the way forward, and packaging technology can quickly enable large-scale innovation in the industry, especially HPC and AI, as chip packaging has become a hot topic recently.

As the need for more powerful computing increases and the semiconductor industry enters a heterogeneous era using multiple "dielets" in packages, improvements in signal transmission speeds, power delivery, design rules and package substrate stability will be critical.

According to Intel, glass substrates have superior mechanical, physical and optical properties compared to today's organic substrates, allowing more transistors to be connected in a package, providing better scalability and enabling the assembly of larger chiplet complexes . Chip architects will be able to pack more blocks in a smaller footprint on a single package while achieving performance and density gains with greater flexibility and lower overall cost and power consumption.

According to reports, the glass substrate can withstand higher temperatures, reduce pattern distortion by 50%, have ultra-low flatness to improve the focal depth of lithography, and has the dimensional stability required for extremely tight inter-layer interconnect coverage. Due to these unique properties, interconnect density on glass substrates can be increased by a factor of 10. In addition, the mechanical properties of the glass are improved, enabling very large packaging with very high assembly yields.

The glass substrate's tolerance to higher temperatures also provides chip architects with flexibility in how they set power delivery and signal routing design rules, as it allows them to seamlessly integrate optical interconnects and integrate inductors at higher temperatures. Devices and capacitors are embedded in glass. This provides a better power transfer solution while enabling the required high-speed signal transmission at much lower power. These advantages bring the industry one step closer to scaling 1 trillion transistors in packaging by 2030.

Lansheng Technology Limited, which is a spot stock distributor of many well-known brands, we have price advantage of the first-hand spot channel, and have technical supports. 

Our main brands: STMicroelectronics, Toshiba, Microchip, Vishay, Marvell, ON Semiconductor, AOS, DIODES, Murata, Samsung, Hyundai/Hynix, Xilinx, Micron, Infinone, Texas Instruments, ADI, Maxim Integrated, NXP, etc

To learn more about our products, services, and capabilities, please visit our website at http://www.lanshengic.com