Intel teams up with TSMC to develop multi-chip packaging chips

 


【Lansheng Technology News】On September 22, Intel announced that it would work with TSMC to create the world’s first multi-chip package chip that complies with the Chiplet Interconnect Industry Alliance standards, including ICs produced by Intel and TSMC respectively. According to industry analysis, chiplet architecture design can help reduce IC design and system customer costs by integrating chips from different processes and achieving differentiated stacking through advanced packaging technology, enabling more diverse chip applications.


As one of the world's largest semiconductor manufacturers, Intel has been seeking cooperation with other companies to improve its competitiveness. This cooperation with TSMC is undoubtedly another important move for Intel in the global semiconductor industry layout. TSMC has further enhanced its technical strength and market position through this cooperation.


Previously, Intel CEO Pat Gelsinger gave a speech at the Deutsche Bank 2023 Technology Conference, announcing that Intel would regain its leading position in chip manufacturing node technology in 2025. This announcement aroused the attention and expectations of the industry.


Gelsinger revealed that Intel has successfully secured an important "partner" to provide manufacturing services for its 18A node and expects to launch the node in 2025. This means Intel is going all out to restore its leadership in chip manufacturing. However, the cooperation between Intel and TSMC also comes with competition. TSMC has announced plans to launch its own 2nm process node in 2025, and has received support from important customers including Qualcomm, Nvidia, AMD, MediaTek and Apple.


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