ROHM launches silicon capacitor "BTD1RVFL series" for the first time

 


【Lansheng Technology News】ROHM has newly developed silicon capacitors that are increasingly used in fields such as smartphones and wearable devices. Utilizing ROHM's silicon semiconductor processing technology accumulated over the years, the new product achieves both smaller size and higher performance.


As applications such as smartphones increase their functions and improve their performance, the industry's demand for small components that support higher mounting density is increasing. Silicon capacitors use thin film semiconductor technology and are thinner and have greater capacitance than multilayer ceramic capacitors (MLCC). Due to its stable temperature characteristics and excellent reliability, this product is increasingly used in applications. ROHM predicts that the market size of silicon capacitors will grow to 300 billion yen* in 2030, approximately 1.5 times the size in 2022. Therefore, ROHM develops small and high-performance silicon capacitors using its own semiconductor process.


ROHM's silicon capacitors adopt its own miniaturization technology RASMID*1 that can be processed in units of 1 μm, eliminating defects in the appearance molding process and achieving high-precision dimensional tolerances within ±10 μm. Because the product size fluctuates very little, it can support narrower mounting pitches; in addition, by expanding the back electrode connecting the circuit board to the edge of the package, mounting strength is also improved.


The size of the first batch of products, the "BTD1RVFL series", is only 0402 (0.4mm × 0.2mm), which is the industry's ultra-small surface mount mass-produced silicon capacitor. Compared with ordinary products of 0603 size, its installation area is reduced by about 55% to only 0.08mm2, which is very helpful for miniaturization of application products. In addition, the new product has a built-in TVS protection device to ensure excellent ESD*2 resistance and reduce circuit design work such as surge countermeasures.


The "BTD1RVFL series" includes the "BTD1RVFL102" with a capacitance of 1000pF and the "BTD1RVFL471" with a capacitance of 470pF. It has been put into mass production starting in August 2023 with a monthly production capacity of 500,000 units. The production base for the front-end process is ROHM Co., Ltd., and the production base for the back-end process is ROHM Apollo Co., Ltd.


ROHM plans to develop a second wave of products with excellent high-frequency characteristics in 2024 for fields such as high-speed and large-capacity communication equipment. In addition, ROHM will also focus on developing products suitable for industrial equipment such as servers to further expand the scope of applications.


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