How to choose Mil STM32MP1 series core board and development board

 


【Lansheng Technology News】For engineers, choosing a suitable processor for development is a particularly important step. As for how to choose a core board suitable for your own design and development, today we will use ST's MP1 series processors Analyze and compare.


ST has currently released two different types of MPU chips, namely the STM32MP15 series and STM32MP13 series. The characteristics of these two chips are also very distinctive. The STM32MP15 uses an ARM A7 + M4 heterogeneous CPU, which can realize dual systems to support Linux and real-time applications, and has a 3D GPU and MIPI display interface; the STM32MP13 series has been streamlined compared to the 15 series, and the processor frequency has been increased to 1GHz. Dual Gigabit Ethernet and dual CAN FD are very suitable for industrial Internet of Things and automotive communication fields; and are extremely cost-effective and low power consumption mode.


As ST's annual official partner, Mil Electronics has followed ST's footsteps since 2019 and simultaneously released STM32MP151, 157 and this year's STM32MP135 series core boards and development boards. Mil uses a high-performance stamp hole design, compact size and reliable connection. It has built-in power management, DDR, EMMC/NAND FLASH chip, which makes it easier for customers to skip complex power supply design. The exclusive metal shield can prevent dust and touch, and can also be customized according to the requirements. Laser engraving design according to customer needs.


And how to choose a suitable core board for design? We can compare through the following points.

1. Different processor performance

The MYC-YA15XC-T core board is based on the STM32MP151 processor. This CPU is a heterogeneous structure of a single Cortex-A7+single Cortex-M4.

The MYC-YA157C core board is based on the STM32MP157 processor. This CPU is a heterogeneous structure of dual-core Cortex-A7 + single Cortex-M4. It also integrates GPU, MIPI DSI, CAN FD and other control units.

The MYC-YF13X core board is based on the STM32MP135 processor. This CPU is a single-core Cortex-A7 processor with a maximum frequency of 1GHZ. It also integrates dual-channel Gigabit Ethernet, two-channel CAN FD and other control units.


2. Different modules

MYC-YA157C has one more gigabit network than MYC-YA15XC-T. MYC-YA15XC-T uses ST's power management chip, STPMIC1.


3. Different sizes

The sizes of the three modules are different, MYC-YF13X and MYC-YA15XC-T are 39*37mm, and the MYC-YA157C core board is 43*45mm.


4. The connection PIN is different

The three modules have different numbers of pins. MYC-YF13X and MYC-YA15XC-T have 148PIN stamp holes, while the MYC-YA157C core board has 164PIN stamp holes.


So how do engineers choose suitable modules?

Generally speaking, if the project has relatively high requirements on performance, network, display, etc., and also needs peripheral resources such as can and mipi screen, I recommend using the core module MYC-YA157C. If it is for cost considerations and does not require too high performance and too many peripheral resources, you can prioritize the evaluation of the MYC-YA15XC-T core module. For customers who want to upgrade from MCU to Linux operating system and use dual-channel Ethernet, they can evaluate the core module MYC-YF13X. Currently, our three products have application cases in industrial interconnection smart gateways, smart building access management, ubiquitous power FTU/DTU, and industrial HMI.


Mil also provides supporting development boards based on the STM32MP1 series core boards, which bring different design experiences to customer development. The supporting information is rich and convenient for developers to evaluate.


Lansheng Technology Limited, which is a spot stock distributor of many well-known brands, we have price advantage of the first-hand spot channel, and have technical supports. 

Our main brands: STMicroelectronics, Toshiba, Microchip, Vishay, Marvell, ON Semiconductor, AOS, DIODES, Murata, Samsung, Hyundai/Hynix, Xilinx, Micron, Infinone, Texas Instruments, ADI, Maxim Integrated, NXP, etc

To learn more about our products, services, and capabilities, please visit our website at http://www.lanshengic.com

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