Samsung to expand NAND chip factory in Xi'an, China
【Lansheng Technology News】Samsung Electronics plans to upgrade its Xi'an NAND flash memory factory to a 236-layer NAND process and begin large-scale expansion. According to foreign media, Samsung Electronics plans to upgrade its Xi'an NAND flash memory factory to a 236-layer NAND process and begin large-scale expansion.
According to the report, Samsung has begun purchasing the latest semiconductor equipment. The new equipment is expected to be delivered by the end of 2023, and equipment capable of producing 236-layer NAND will be gradually introduced at the Xi'an factory in 2024.
Earlier news said that the United States agreed to Samsung Electronics and SK Hynix provide equipment to its factories in China without other licenses.
It is understood that Samsung's Xi'an factory has become the world's largest NAND manufacturing base, accounting for approximately 40% of Samsung's total NAND output.
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