Intel's new processor is expected to set off a wave of AIPC replacements and drive storage specification upgrades

 


【Lansheng Technology News】Intel's new processor Meteor Lake will be launched on December 14, and the technology industry has high hopes that it will trigger a wave of AI PC replacements. It is understood that ODM foundries and brand players have prioritized the introduction of high-end commercial models and are aiming to exhibit them at CES in early January next year. Industry players pointed out that the new CPU architecture will also drive the upgrade of peripheral components in the supply chain. In addition to TSMC, In addition to ASE, DDR5 Nanya and Youqun, PCIe Gen5 Parade-KY and Xiangshuo, as well as Xinxing, which has increased the number of carrier board layers, are all expected to benefit.


The AI era has officially arrived, and Intel is planning a new architecture Core Ultra processor (codenamed Meteor Lake). This CPU is also Intel's first processor equipped with an NPU. The goal is to achieve efficient AI acceleration and edge inference applications on PCs; and Meteor Lake adopts a Tile (chip block) architecture, which is similar to AMD's use of chiplets (small chips). By connecting multiple process chip blocks in series, it can achieve high density, high energy efficiency, and low latency processors.


Currently, only the Compute Tile (processing chip block) uses Intel's own Intel 4 process; the Graphics Tile (graphics chip block) and SoC Tile (system chip block) use TSMC's N5 and N6 advanced processes respectively. TSMC, ASE, etc. are the first to benefit.


In addition, AI PC will also drive corresponding specification upgrades of peripheral components. In terms of memory, the current mainstream PC memory still uses DDR4 4Gb/8Gb. As the AI large language model parameters grow exponentially, Meteor Lake fully supports DDR5 with higher capacity and faster speed, which will help the penetration rate of DDR5 to continue to increase. Taiwan Nanya Technology is actively entering the market, while Youqun is seizing business opportunities with memory connectors.


Various AI applications are booming, Meteor Lake also fully supports PCIe Gen5, and the demand for high-speed transmission will also grow. In terms of the carrier board, although the overall area of the carrier board is similar to that of the previous two generations of PC processors, due to the use of Intel's 3D Foveros advanced packaging technology, four Tiles will be integrated on the same wafer substrate, and the number of carrier board layers is expected to increase from 10 to 10. The layer has been upgraded to 12 layers, and Intel's carrier board partners Xinxing and Jianding are also expected to benefit from the growth in volume.


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