Microchip launches press-fit terminal power modules SP1F and SP3F

 


【Lansheng Technology News】The electric vehicle, sustainability and data center markets require products that facilitate high-volume manufacturing. To better automate the installation process, the industry often uses press-fit terminals as they provide a solder-free solution for mounting power modules to printed circuit boards. Microchip Technology Inc. today announced the launch of a product portfolio of SP1F and SP3F power modules adapted for crimp terminals to support high-volume applications.


Solderless press-fit power module terminals allow automated or robotic installation, simplifying and speeding up the assembly process and reducing manufacturing costs. The SP1F and SP3F power module terminals have high pin-pointing accuracy and adopt a novel press-fit pin design to achieve high-reliability contact with the printed circuit board. Overall, press-fit power module solutions save valuable time and production costs.


Microchip's SP1F and SP3F power module product portfolio includes more than 200 models, with a choice of mSiC™ technology or Si semiconductors, and a range of topologies and ratings. SP1F and SP3F have a voltage range of 600V-1700V and a current of up to 280A.


By using press-fit technology, the power module pins are not soldered to the printed circuit board, but electrical connections are made by pressing the pins into appropriately sized PCB holes. A major advantage of the press-fit power module solution is that no wave soldering is required. This is especially important when the printed circuit board also includes surface mount technology (SMT) components.


The highly configurable SP1F and SP3F power modules are fully compliant with the Restriction of Hazardous Substances Directive (RoHS).


Lansheng Technology Limited, which is a spot stock distributor of many well-known brands, we have price advantage of the first-hand spot channel, and have technical supports.

Our main brands: STMicroelectronics, Toshiba, Microchip, Vishay, Marvell, ON Semiconductor, AOS, DIODES, Murata, Samsung, Hyundai/Hynix, Xilinx, Micron, Infinone, Texas Instruments, ADI, Maxim Integrated, NXP, etc

To learn more about our products, services, and capabilities, please visit our website at http://www.lanshengic.com

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