Copy of ON Semiconductor releases DC ultra-fast charging pile solution to solve key problems in the popularization of electric vehicles

 


【Lansheng Technology News】On January 8, 2024, ON Semiconductor announced the launch of nine new EliteSiC power integrated modules (PIM), which can provide bidirectional charging functions for electric vehicle (EV) DC ultra-fast charging piles and energy storage systems (ESS). Silicon carbide-based solutions will feature higher efficiency and simpler cooling mechanisms, significantly reducing system costs and reducing size by up to 40% and weight by up to 52% compared to traditional silicon-based IGBT solutions. This more compact, lighter charging platform will provide designers with all the key building blocks needed to quickly deploy reliable, efficient and scalable DC fast charging networks to charge electric vehicle batteries to 80% in just 15 minutes.


According to the results of JD Power's 2023 Electric Vehicle Considerations Study, nearly half of U.S. consumers pointed out that the reason for not choosing to buy an electric vehicle is that they are worried about the convenience of charging and the ability to charge quickly, and that the driving experience cannot be guaranteed to be the same as that of traditional internal combustion engines ( ICE) vehicles are as easy and smooth as ever. In the United States, the number of electric vehicle charging piles needs to quadruple by 2025 and eight times by the end of 2030 to meet demand [1] and ensure that public charging station resources can be more equitably and reasonably distributed to drivers.


The rapid growth in power demand has also put tremendous pressure on the current power grid, which may lead to overloading of the power grid. In order to alleviate this problem, bidirectional charging has become a key solution to achieve vehicle-to-grid (V2G technology, Vehicle-to-Grid) power supply. It not only supports conventional battery charging, but also can use electric vehicles as energy storage systems as needed. Home power supply.


The solution helps enable DC fast charging networks and vehicle-to-grid (V2G) power transmission systems by solving access and speed issues, enabling faster charging compared to other charging methods that take hours or even days. Charge the vehicle.



ON Semiconductor offers a comprehensive PIM portfolio for key topologies on the market. This gives designers the flexibility to select the appropriate PIM for the power conversion stage in DC fast charging or energy storage system applications. To accelerate the design cycle, designers can also generate advanced piecewise linear circuit simulation (PLECS) models through ON Semiconductor's self-service PLECS model generation tool and perform application simulation through the portfolio's Elite Power simulation tool.


For each module, ON Semiconductor uses chips from the same wafer to ensure greater consistency and reliability, so designers do not experience different performance results by using discrete devices from different vendors. In addition to reliability, this module portfolio offers the following benefits:


l Adopts third-generation M3S SiC MOSFET technology to provide ultra-low switching losses and ultra-high efficiency

l Supports key topologies such as multi-level T-type neutral point clamp (TNPC), half-bridge and full-bridge

l Supports scalable output power segments from 25 kW to 100 kW, and supports multiple DC fast charging and energy storage system platforms, including bidirectional charging

l Available in industry standard F1 and F2 packages with optional pre-applied thermal interface material (TIM) and crimp pins

l Achieve optimal thermal management and avoid system failures caused by overheating

l Full silicon carbide module minimizes power loss, thereby achieving energy saving and cost reduction

l Provide higher robustness and reliability to ensure continuous and consistent work


Lansheng Technology Limited, which is a spot stock distributor of many well-known brands, we have price advantage of the first-hand spot channel, and have technical supports.

Our main brands: STMicroelectronics, Toshiba, Microchip, Vishay, Marvell, ON Semiconductor, AOS, DIODES, Murata, Samsung, Hyundai/Hynix, Xilinx, Micron, Infinone, Texas Instruments, ADI, Maxim Integrated, NXP, etc

To learn more about our products, services, and capabilities, please visit our website at http://www.lanshengic.com

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