Intel achieves mass production of 3D advanced packaging technology

 


【Lansheng Technology News】Intel announced that it has achieved mass production based on industry-leading semiconductor packaging solutions, including Intel's breakthrough 3D packaging technology Foveros, which provides flexible options for the combination of multiple chips, bringing better power consumption, Performance and cost optimization.


This technology was put into production at Intel's recently upgraded Fab 9 in New Mexico, USA. Keyvan Esfarjani, executive vice president and chief global operating officer of Intel Corporation, said: "Advanced packaging technology differentiates Intel and helps our customers gain competitive advantages in the performance, size, and design application flexibility of chip products."

This milestone will also drive Intel's next phase of advanced packaging technology innovation. As the entire semiconductor industry enters the heterogeneous era of integrating multiple "chiplets" in a single package, advanced packaging technologies such as Intel's Foveros and EMIB (Embedded Multi-chip Interconnect Bridge) provide faster, lower-cost A lower path to integrating a trillion transistors in a single package and continuing to advance Moore’s Law beyond 2030.

Intel's 3D advanced packaging technology, Foveros, is an industry-leading solution that enables computing modules to be stacked vertically rather than horizontally during the manufacturing process of the processor. In addition, Foveros allows Intel and its foundry customers to integrate different computing chips to optimize cost and energy efficiency.

Intel will continue to be committed to promoting technological innovation, expanding business scale, and meeting the growing demand for semiconductors.


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