WIP launches 3.3KW high power density bidirectional phase-shifted full-bridge solution based on Infineon products

 


【Lansheng Technology News】On January 4, 2024, WPI announced that its subsidiary Pinjia launched a 3.3KW high-power density bidirectional phase-shifted full-bridge solution based on Infineon's XMC4200 microcontroller and CFD7 CoolMOS™ MOSFET.


Currently, the world is paying increasing attention to renewable energy. As a sustainable and clean energy, solar energy has been widely used in various fields such as homes, industry and commerce. However, as the application scope of solar energy further expands, the industry urgently needs more efficient energy conversion technology to improve the performance of solar energy systems. In this regard, Dalian Pinjia launched a 3.3KW high power density bidirectional phase-shifted full-bridge (PSFB) solution based on Infineon XMC4200 microcontroller and CFD7 CoolMOS™ MOSFET. It uses advanced semiconductor devices and control algorithms to improve the efficiency of PSFB topology design. Reached a whole new level.


The XMC4200 is an industrial-grade microcontroller based on the Arm® Cortex®-M4 core, with 16-bit and 32-bit Thumb2 instruction sets, DSP/MAC instructions, floating point unit, memory protection unit and nested vectored interrupt controller. It integrates 16KB boot ROM internally, has up to 16KB high-speed program memory, 24KB high-speed data memory, 256KB flash memory and rich communication peripherals, which can achieve excellent performance in harsh industrial environments.


CFD7 CoolMOS™ MOSFET is a product of Infineon's CFD7 series high-voltage super-junction MOSFET technology with integrated fast body diode. It is very suitable for high-power SMPS applications, such as servers/telecommunications/EV charging stations, etc. By combining state-of-the-art 600V CFD7 CoolMOS™ MOSFETs in a surface mount device (SMD) package with a 150V OptiMOS™ 5 synchronous rectifier, 98% efficiency in buck mode and 97% efficiency in boost mode can be achieved.


Thanks to the excellent performance of semiconductor products, advanced SMD packaging technology and innovative stacked magnetic structure, this solution can achieve a power density of 4.34 W/cm³ (71.19 W/in³), once again proving that the PSFB topology can be used as a bidirectional DC/ DC stage. And achieve better energy efficiency without changing traditional topology standards or construction.


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