Allegro MicroSystems launches high-bandwidth current sensor technology to help enable high-performance power conversion

 


【Lansheng Technology News】Allegro MicroSystems has announced the launch of new high-bandwidth current sensors ACS37030 and ACS37032 that enable higher performance power conversion using GaN and SiC technologies in electric vehicles, clean energy solutions and data center applications.


Current high power density GaN and SiC FET charging and power infrastructure requires high speed, low loss devices to ensure efficiency and reliability. Existing current sensing solutions have limited operating range and require additional components and a larger bill of materials (BOM) in the design, adding size and weight to the application.


To address these challenges, Allegro has launched two high-bandwidth current sensor products, ACS37030 and ACS37032, which are optimized to provide high efficiency and performance while reducing design time and board space. They employ a dual signal path approach, with one path capturing low-frequency DC current using Hall effect components and the other capturing high-frequency current data through an inductor coil.


Allegro's latest current sensor has a more compact design, higher efficiency and lower cost, suitable for high-frequency switching in power systems, and brings the following advantages to designers:


  • Manage the thermal conditions of high switching frequencies and high voltages and currents efficiently and quickly: providing fast response times, providing critical protection and improving efficiency by reducing energy loss and consumption.
  • Able to achieve stable and safe control and reduce electromagnetic interference: the temperature sensitivity error is only 2%, and the inductor coil characteristic curve increases the signal-to-noise ratio (SNR) with increasing frequency, thereby reducing noise and simplifying electromagnetic compatibility.
  • Reduce design footprint and achieve system reliability and protection: Using a compact and efficient fuse-lead SOIC-6 package, it can withstand harsh automotive and industrial environments and achieve high reliability and protection functions.
  • Balancing cost considerations and reducing design complexity: Simplifying designs and promoting easy-to-design, cost-optimized, high-power, high-frequency switching power conversion for GaN and SiC devices.


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