Vishay launches TrenchFET fifth-generation power MOSFET in PowerPAK 1212-F package using source flip chip technology

 


【Lansheng Technology News】On February 20, 2024, Vishay Technology announced the launch of the multifunctional new 30V n-channel TrenchFET® fifth-generation power MOSFET---SiSD5300DN, which will further improve the power density and enhance thermal performance of industrial, computer, consumer electronics and communication applications. . Vishay Siliconix SiSD5300DN adopts source flip-chip technology 3.3 mm x 3.3 mm PowerPAK® 1212-F package. The on-resistance is only 0.71 mW under the condition of 10V gate voltage. The product of on-resistance and gate charge is the key to MOSFET in switching applications. The figure of merit (FOM) is 42 mW*nC, reaching the industry’s advanced level.


The device released recently has the same footprint as the PowerPAK 1212-8S package, with an 18% reduction in on-resistance and increased power density. At the same time, the source flip-chip technology reduces the thermal resistance from 63°C/W to 56°C/W. In addition, the SiSD5300DN's figure of merit is 35% lower than the previous generation device, reducing conduction and switching losses and saving energy in power conversion applications.


PowerPAK1212-F source flip-chip technology reverses the usual positions of the ground pad and source pad, enlarging the ground pad area and providing a more effective heat dissipation path, helping to reduce operating temperature. At the same time, PowerPAK 1212-F reduces the switching area range, helping to reduce the impact of trace noise. In addition, the PowerPAK 1212-F package source pad size has been increased by 10 times, from 0.36mm2 to 4.13mm2, thereby improving thermal performance. The PowerPAK1212-F central gate structure also simplifies the use of multiple devices in parallel on a single-layer PCB substrate.


Vishay's SiSD5300DN in a flip-source PowerPAK1212-F package is ideally suited for applications such as secondary rectification, active clamp battery management systems (BMS), buck and BLDC converters, OR-ing FETs, motor drivers and load switches. Typical end products include welding equipment and power tools, servers, edge devices, supercomputers, tablets, lawn mowers and sweepers, and radio base stations.


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