Infineon and Wemax strengthen cooperation to provide energy-saving and economical fast charging services for electric vehicles

 


【Lansheng Technology News】Infineon Technologies AG's new CoolSiC™ hybrid discrete devices feature TRENCHSTOP™ 5 fast-switching IGBTs and CoolSiC Schottky diodes. Shenzhen Wemax New Energy Co., Ltd. uses this device for its next-generation 6.6 kW OBC/DCDC vehicle charger. Infineon's components, available in D²PAK packages, combine ultra-fast TRENCHSTOP 5 IGBTs with silicon carbide (SiC) Schottky barrier diodes, offering a perfect price-performance ratio in hard-switching and soft-switching topologies. With its excellent performance, optimized power density and leading quality, this power semiconductor device is highly compatible with Vimax's on-board charger.


Xu Jinzhu, product line director and chief engineer of Wemax’s R&D department, said: “We are very pleased to choose Infineon’s CoolSiC Hybrid device for our next-generation OBC to achieve higher reliability, stability, performance and power density. This deepens our cooperative relationship with Infineon, and through close collaboration, we promote technological application innovation and jointly promote the vigorous development of new energy vehicles."


Robert Hermann, Vice President of the Automotive High Voltage Chip and Discrete Devices Product Line at Infineon Technologies, said: "We are pleased to strengthen our cooperation with VMAX with highly efficient hybrid products. Together we will continue to promote the development of electric vehicles and meet the needs of high-efficiency solutions." Industry requirements for performance, quality and system cost.”


This hybrid discrete device uses a fast hard-switching TRENCHSTOP 5 650 V IGBT co-packaged with a zero-reverse-recovery CoolSiC Schottky diode, resulting in extremely low switching losses at switching speeds in excess of 50 kHz. This makes the device an excellent choice for high-power electric vehicle charging systems. In addition, the rugged 5th generation CoolSiC Schottky diodes offer greater surge current resistance, maximizing reliability. Diffusion welding of this SiC diode improves the thermal resistance (Rth) of the package, allowing for smaller die size, thereby increasing power switching capabilities. With these features, the product achieves greater system reliability and service life, meeting the stringent requirements of the automotive industry. To maximize compatibility with existing designs, the product also features a pin-to-pin compatible design based on the widely used D²PAK package.


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