Daily Information by Lansheng Technology
1.ON Semiconductor's silicon carbide technology will be integrated into BMW's next-generation electric vehicles
Recently, #Onsemi announced the signing of a long-term supply agreement (LTSA) with #BMW Group, using Onsemi's EliteSiC technology for the German high-end automaker's 400V DC bus electric drivetrain. ON Semiconductor's latest EliteSiC 750VM3 chip is integrated into a full-bridge power module that can deliver hundreds of kilowatts of power.
2.Samsung is accelerating the commercialization of 3D DRAM
According to foreign media "BusinessKorea" reports, #Samsung Electronics' main semiconductor leader recently stated at a #semiconductor conference that he is accelerating the commercialization of 3DDRAM and believes that 3DDRAM is a way to overcome the physical limitations of DRAM.
Considering the current situation of shrinking the line width of #DRAM to 1nm, the industry believes that the commercialization of new DRAM in 3 to 4 years will become a necessity, not a direction.
3.In 2023, the output value of SiC power #components #market will exceed 2.2 billion US dollars
On March 9, according to TrendForce’s research, with the clarification of #onsemi, Infineon and other cooperation projects with automotive and energy companies, the overall SiC power device market output value will reach 22.8 in 2023 billion U.S. dollars, with an annual growth rate of 41.4%.
PS:Lansheng Technology Limited (https://www.lanshengic.com/) is a global distributor of electronic components that has been established for more than 10 years, headquartered in Shenzhen China, who mainly focuses on electronic spot stocks.
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