Micron launches its first UFS 4.0 product with sequential read and write up to 4,300 MB/s, 4,000 MB/s

 


According to the information collected by Lansheng Technology, Micron has recently launched the first storage device compliant with the UFS 4.0 standard, which is expected to be used in flagship smartphones, tablets and ultra-low-power notebooks to be launched this year.


Micron UFS 4.0 storage devices provide three capacity options of 256GB, 512GB and 1TB, using self-developed controllers and firmware. Among them, the 512GB and 1TB UFS 4.0 products use Micron's 232-layer six-plane 1Tb 3D TLC NAND, which can provide a sequential read speed of up to 4,300 MB/s and a sequential write speed of up to 4,000 MB/s. And the 256 GB version is slightly slower because it uses quad-plane 3D NAND.


In addition to offering higher performance than its predecessor, Micron's UFS 4.0 products are said to improve energy efficiency by 25 percent through a combination of higher performance and power-saving features.


The use of high-capacity 232-layer 3D TLC NAND makes UFS 4.0 products thinner, which will help mobile phone manufacturers to make products thinner and lighter, or install higher-capacity batteries.


Micron is currently sampling UFS 4.0 memory modules to leading smartphone manufacturers and expects these products to be available in the coming months or quarters after mass production begins in the second half of the year.


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