GF and Microchip announce production of Microchip’s 28nm SuperFlash embedded flash memory solution

 



【Lansheng Technology News】GF and Microchip Technology Inc. and its subsidiary Silicon Storage Technology® announced today that the SST ESF3 third-generation embedded SuperFlash technology NVM solution using the GF 28SLPe process will be put into production soon.


GF has set a new industry benchmark in implementing SST's widely deployed ESF3 SuperFlash technology. This implementation has the following features and advantages:

  • Lowest cost 28nm HKMG ESF3 solution with only 10 additional masks, including true 5V IO CMOS devices
  • SST ESF3 bit cell size is less than 0.05 square microns, very competitive
  • Operating temperature rating −40°C to 125°C
  • Read access time is 25 ns, programming time is 10 us, and erase time is 4 ms
  • Endurance over 100,000 program/erase cycles
  • Does not affect the design process (EG process) using qualified IP of the GF 28SLPe platform
  • Ready-made macros from 4 Mb to 32 Mb available immediately
  • Custom macro design support available from SST or GF


As the level of edge intelligence continues to increase, the use cases for embedded flash memory have also exploded. Embedded memory for secure code storage, OTA updates and enhanced functionality is on the rise in a wide range of applications in home and industrial IoT and smart mobile devices. Meeting these needs requires innovative platforms.


“GF is proud to partner with SST to develop, qualify and bring into production this impressive embedded NVM solution on our powerful 28SLPe platform,” said Mike Hogan, chief business unit officer at GF. “GF’s customers are discovering "This solution combines high performance, outstanding reliability, IP availability and cost-effectiveness, making it ideal for advanced MCUs, complex smart cards, and IoT chips for consumer and industrial products."


Mark Reiten, Vice President of Microchip’s Licensing Business Unit and SST said: “SST has worked closely with GF over the past decade to integrate and productize SST’s industry-standard ESF1 and ESF3 embedded flash technologies into GF’s 130nm BCD, 55nm, 40nm and current 28nm process platforms. We admire GLOBALFOUNDRIES for its leadership in offering the broadest range of embedded NVM solutions and look forward to our close partnership leading to more breakthroughs over the next decade."


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