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Indian semiconductors on the rise: Tata plans to build manufacturing facility in Sanand, Gujarat

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  【Lansheng Technology News】The rise of Indian semiconductors: Tata plans to build Micron’s US$2.75 billion chip manufacturing facility in Sanand, Gujarat. The company said in a statement that the contract award to Tata Projects solidifies the company's presence in the development of large-scale, sustainable infrastructure in the Indian manufacturing sector. Tata Projects has won a construction contract from  Micron Technologies  for its state-of-the-art semiconductor assembly and testing facility in Sanand, Gujarat. “This long-lasting project is a major milestone and the largest investment by an Indian semiconductor delegation,” he said, adding that the first phase of construction will include 500,000 square feet of clean room space and is scheduled to be operational by the end of 2024. The project includes the design and construction of a first-of-its-kind DRAM and NAND assembly and testing facility in India. The Tata project aims to accelerate construction through 4D B...

Broadcom forced Samsung to sign an unequal long-term contract and was fined 19.1 billion won by South Korea

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  【Lansheng Technology News】Recently,  Broadcom , an internationally renowned semiconductor company, has been severely sanctioned by the Korean Fair Trade Commission for its abuse of its market dominance, with a fine of up to 19.1 billion Korean won, approximately RMB 104 million. The story behind this punishment reveals unfair business practices in market competition and also triggers profound thinking about market norms and supervision. South Korea's FTC pointed out in its official statement that Broadcom used a series of unfair means, including suspending order approval, cutting off supply, and technical support, to force Samsung to sign a long-term procurement contract in 2020. According to this contract, Broadcom requires Samsung to purchase smartphone parts worth a total of US$760 million per year from 2021 to 2023. If the purchase amount is lower than this standard, Samsung will also need to pay the difference. South Korea's FTC believes that  Broadcom  has fo...

STMicroelectronics joins hands with Leopard Imaging to bring cockpit monitoring system to the general public

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  【Lansheng Technology News】In May last year, Leopard Imaging launched an in-car camera module at the Embedded Vision exhibition, which became a new milestone in the history of driver monitoring system development and opened up a road to popularize DMS in cars. As an authorized partner of  STMicroelectronics , Leopard Imaging has previously launched a variety of in-car camera modules using STMicroelectronics' VG5761 devices. Now it supports wider lighting conditions by using  STMicroelectronics'  VB56G4A back-illuminated global shutter image sensor to improve the accuracy of machine learning algorithms while reducing the overall power consumption of the system. As a result, Leopard Imaging can provide automobile manufacturers with more solution options, including modules with and without backlight, making driving monitoring systems and occupant monitoring systems mainstream applications. ST's VG56G4A device allows DMS/OMS to adapt to more environments Leopard Imaging...

Intel teams up with TSMC to develop multi-chip packaging chips

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  【Lansheng Technology News】On September 22,  Intel  announced that it would work with TSMC to create the world’s first multi-chip package chip that complies with the Chiplet Interconnect Industry Alliance standards, including ICs produced by Intel and TSMC respectively. According to industry analysis, chiplet architecture design can help reduce IC design and system customer costs by integrating chips from different processes and achieving differentiated stacking through advanced packaging technology, enabling more diverse chip applications. As one of the world's largest semiconductor manufacturers,  Intel  has been seeking cooperation with other companies to improve its competitiveness. This cooperation with TSMC is undoubtedly another important move for Intel in the global semiconductor industry layout. TSMC has further enhanced its technical strength and market position through this cooperation. Previously, Intel CEO Pat Gelsinger gave a speech at the Deutsch...

Renesas Electronics integrates Reality AI tools with e2 studio IDE to expand its preeminent position in AIoT

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  【Lansheng Technology News】 Renesas Electronics , a global semiconductor solutions provider, recently announced that it has established an interface between its Reality AI Tools® and e2 studio integrated development environments, allowing designers to seamlessly share data, projects and software between the two programs. AI code module. The real-time data processing module has been integrated into the Renesas MCU software development tool kit to facilitate data collection from Renesas' own tool kit or customer hardware using Renesas MCUs. This integration will shorten the design cycle for IoT network edge and terminal artificial intelligence (AI) and micro machine learning (Tiny ML) applications. Since  Renesas  acquired Reality AI in 2022, it has been committed to researching, improving and simplifying AI design. Reality AI Tools is a software environment built to support complete AI application product development, allowing users to automatically explore sensor data an...